SAN JOSE, CALIFORNIA–(Marketwired – Nov. 6, 2017) – Spectra7 Microsystems Inc. (TSX:SEV) (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity markets and Foxconn Interconnect Technology, Inc. (Foxconn), a leading supplier of interconnect solutions today announced a collaboration to bring several new active copper data center interconnect products to market. These products are currently sampling to tier one data center OEMs.

“Spectra 7 is a key player in the active copper cable market and Foxconn Interconnect Technology has confidently adopted Spectra7 solutions as a fundamental component of our active cable development,” said Yan Margulis, VP Sales and Marketing at Foxconn.

New interface standards such as QSFP-DD, SFP-DD and others are dramatically increasing port density in data center switching systems, but are also limiting the interconnect length that can be served by low-cost direct attach copper (DAC) cables. Spectra7’s GaugeChanger Plus™ silicon allows copper cables up to three times the reach of passive copper cables. These active copper cables (ACCs) lower power consumption by approximately 80% and are half the cost when compared to the other alternative active optical cables (AOCs).

Foxconn supplies a broad range of interconnects to major data center equipment manufacturers and operators. “We’re extremely proud to be working closely with such a major interconnect supplier to the data center market”, said Spectra7 CEO Raouf Halim. “The joint collaboration with Foxconn Interconnect Technology is another major milestone in the validation of our data center technology.”

ABOUT FOXCONN INTERCONNECT TECHNOLOGY, LIMITED (“FIT”)

Foxconn Interconnect Technology, Limited focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.

For more information, visit FIT’s website: http://www.fit-foxconn.com

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Markham, Ontario, Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.

CAUTIONARY NOTES

Certain statements contained in this press release constitute “forward-looking statements”. All statements other than statements of historical fact contained in this press release, including, without limitation, those regarding the Company’s future financial position and results of operations, strategy, proposed acquisitions, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words “believe”, “expect”, “aim”, “intend”, “plan”, “continue”, “will”, “may”, “would”, “anticipate”, “estimate”, “forecast”, “predict”, “project”, “seek”, “should” or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company’s expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to the risk factors discussed in the Company’s annual MD&A for the year ended December 31, 2016. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.