VANCOUVER, BC–(Marketwired – June 05, 2017) – Intrinsyc Technologies Corporation (TSX: ITC) (OTC: ISYRF) (“Intrinsyc”), a leading developer of intelligent connected devices, today announced the general availability of a new Hardware Development Kit (“HDK”) featuring the Qualcomm® Snapdragon™ 835 Mobile Platform, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

The Snapdragon 835 Mobile Platform is the first commercial SoC manufactured using the 10nm FinFET process node, engineered for breakthrough performance and superior power efficiency. The Snapdragon 835 is designed to support next-generation entertainment experiences and connected cloud services for premium-tier consumer and enterprise devices, including smartphones, VR/AR head-mounted displays, IP cameras, tablets, mobile PCs and other devices.

To support the ecosystem of technology companies and application providers looking to utilize the advanced features of the Snapdragon 835, Intrinsyc Technologies Corporation is introducing the Open-Q™ 835 Hardware Development Kit (“HDK”). The HDK is an open-frame solution that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, as well as provide original equipment manufacturers (“OEMs”), developers and engineers with next generation software technology and tools to accelerate development and testing of devices. It includes all of the software tools and accessories required to immediately begin development work. The HDK is a full featured Android development platform that provides an ideal starting point for creating high-performance mobile devices and applications.

Open-Q™ 835 Hardware Development Kit Specifications:

• Qualcomm® Snapdragon™ 835 (APQ8098) Mobile Platform with Qualcomm® Kryo™ 280 CPU (dual-quad core, 64-bit ARM V8 compliant processors, 2.2GHz and 1.9GHz clusters), Qualcomm® Adreno™ 540 GPU, and Qualcomm® Hexagon™ DSP with Hexagon Vector extensions
• System Memory: 4GB LPDDR4x RAM (POP)
• Storage: 128GB UFS V2.1 flash
  • Connectivity:
    • Wi-Fi® 802.11 a/b/g/n/ac/ad
    • Bluetooth 5.0
    • GNSS (GPS/GLONASS/COMPASS/GALILEO)
    • I/O Interfaces:
      • 1x USB 3.1 Type C +1x USB 2.0 micro-B (UART Logging)
      • DisplayPort over USB 3.1 Type-C
      • 1x Micro SD Card
      • 1x PCIe
      • HDMI 2.0 output – support up to 4K UHD (3840 x 2400 at 60fps) and HDMI 2.0a (4K60)/ 4K30 Miracast.
      • 2x MIPI 4-lane DSI + touch panel
      • 3x MIPI CSI with support for 3D camera configuration
      • 4x Expansion headers for additional features (NFC, sensors etc.)
      • 1x Audio Input and 1x Audio Output Expansion Headers
      • 1 JTAG
• Battery: 3.8V/3200mAh (Optional Accessory)
• Operating System: Android 7
• Optional Accessories:
  • Display: AMOLED LED (1440 x 2560) with PCAP Touch Panel, 5.5″
  • Cameras: 8M FF, Single 12M 2PD, Dual 12M+13M OZ+OIS

“The Snapdragon 835 Mobile Platform offers cutting-edge processing power and performance with the Kryo 280 CPU and Hexagon 682 DSP, and is designed to simultaneously meet the high-performance demands, thermal limits and power efficiency constraints of the next-generation mobile devices,” said Victor Gonzalez, Vice President, Engineering, Intrinsyc. “We are very excited to offer early access to a comprehensive development kit allowing technology companies and connected device makers to accelerate their product development using the powerful and efficient Snapdragon 835 Mobile Platform,”

Users of the Open-Q™ 835 Development Kit will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc’s technical support services.

The Open-Q™ 835 Development Kit is available to order at http://shop.intrinsyc.com.

About Intrinsyc Technologies Corporation

Intrinsyc Technologies is a product development company that provides comprehensive and tailored solutions that enable the development and production of next-generation intelligent connected devices. Solutions span the product development life cycle from concept to production and help makers of intelligent connected devices create compelling differentiated products with faster time-to-market. Intrinsyc is publicly traded (TSX: ITC) (OTC: ISYRF) and is headquartered in Vancouver, BC, Canada. See www.intrinsyc.com for more information.

Intrinsyc and Open-Q are trademarks of Intrinsyc Technologies Corporation.

Qualcomm, Snapdragon, Kryo, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc.

Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners.

Image Available: http://www.marketwire.com/library/MwGo/2017/6/3/11G140328/Images/835-Side-Grey-Background-a27711b281a3a375933938922bf08dbb.jpg

For more information, please contact:
Victor Gonzalez
Vice President, Engineering
Intrinsyc Technologies Corporation
Email: [email protected]
Phone: +1-604-801-6461