Aehr to Showcase its Newest FOX-P™ Test and Reliability Qualification Solutions at SPIE Photonics West 2019 in San Francisco

FREMONT, Calif., Feb. 01, 2019 (GLOBE NEWSWIRE) — Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it will be exhibiting in booth 4046 at the SPIE Photonics West 2019 Conference February 5 – 7 in San Francisco, CA at the Moscone Convention Center.

Aehr will be showcasing its next generation solutions for functional test and early failure rate (EFR) test of optical devices in wafer, panel, singulated die or module form, including its FOX-XP^TM system for high volume production and its new FOX-NP^TM low cost, small footprint entry-level system. In addition to functional test and reliability screening, the FOX systems provide the ability to stabilize laser optical performance, which is critical for the photonics market.

SPIE Photonics West is the world’s premier annual event for the photonics, laser, and biomedical optics industries, spanning biophotonics for brain research and healthcare, lasers for research and advanced manufacturing, sensors and camera systems, imaging and displays, communications and optoelectronics, plus the core optical components that enable many of today’s consumer products.

Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are excited to be showcasing our next generation FOX-P test and burn-in solutions at SPIE Photonics West, including our newest systems that we believe will significantly expand the market for our FOX-P products. We are very optimistic about the silicon photonics and photonics sensors markets and believe they will be significant growth drivers for Aehr. Market research company Yole Développement predicts silicon photonics technology will grow from being used in a few percent of the total optical transceiver market in 2016 to 35% of the market in 2025, with a market value for transceivers of almost $4 billion in 2025.

“The rapid growth of integrated optical devices in high-performance servers and data centers, mobile devices, automotive applications, and now wearable biosensors is driving substantially higher requirements for initial quality and long-term reliability, and the requirements are increasing with every new product generation. We believe these new applications are driving an entirely new level of quality and reliability expectation for these systems and pose a significant long-term growth opportunity for Aehr.”

Aehr’s FOX-P Platform is the company’s next-generation multi-wafer and singulated die/module test solution that is capable of functional test and burn-in/cycling of photonics devices, flash memories, microcontrollers, sensors, and other leading-edge ICs before they are assembled into single or multi-die stacked packages. The FOX wafer-level systems utilize Aehr’s FOX WaferPak^TM contactors, which provide cost effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The configuration with the DiePak^® Carriers enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die, single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.

The key features of the FOX-P Platform that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 “Universal Channels” per wafer or DiePak carrier, which allows the system to test all the devices on the wafer or DiePak carrier in parallel. The innovative “Universal Channel” architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. A single FOX-XP test system may be configured with up to 18 blades of wafer test resources, enabling up to 18 wafers to be tested simultaneously. The footprint of the 18-wafer test system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time. The highly integrated 2-blade FOX-NP system has a very small footprint and is designed to be easily integrated into product design, reliability and test lab applications.

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr products in package, wafer level, and singulated die/module level test. Aehr has developed and introduced several innovative products, including the ABTS^TM and FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX-XP WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr’s website at www.aehr.com.

Safe Harbor Statement
This press release contains certain forward-looking statements based on current expectations, forecasts and assumptions that involve risks and uncertainties. These statements are based on information available to Aehr as of the date hereof and actual results could differ materially from those stated or implied due to risks and uncertainties. Forward-looking statements include statements regarding Aehr’s expectations, beliefs, intentions or strategies regarding its products, including statements regarding future market opportunities and conditions, expected product shipment dates and customer orders or commitments. These risks and uncertainties include, without limitation, customer demand and acceptance of Aehr’s products, the ability of new products to meet customer needs or perform as described, as well as general market conditions and Aehr’s ability to execute on its business strategy. See Aehr’s recent 10-K, 10-Q and other reports from time to time filed with the Securities and Exchange Commission for a more detailed description of the risks facing Aehr’s business. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.