Company expands its U.S. presence to enhance adoption of IoT technologies
SAN JOSE, Calif., Jan. 03, 2019 (GLOBE NEWSWIRE) — DSP Group®, Inc. (NASDAQ: DSPG), a leading global provider of integrative wireless chipset solutions for converging communications, today announced the appointment of Bill Scheffler as Vice President of Business Development. Mr. Scheffler brings over 30 years of experience, successfully introducing new technologies including Internet of Things (IoT) X10 and Z-Wave into home and security communications ecosystems across the U.S. Mr. Scheffler will focus on promoting the benefits of the company’s Ultra Low Energy (ULE) technology to the U.S. market, reporting to Tali Chen, the company’s Chief Marketing Officer.
Mr. Scheffler has strong track record of growing business opportunities and partnerships across the semiconductor and communications sectors. Most recently he served as an executive at Sigma Designs, where he built the Z-Wave brand and helped transform it to an industry standard.
“It’s a great achievement to have a talent of Bill’s caliber join our team and a statement of confidence in our IoT business and ULE’s adoption going forward. Bill brings an extraordinary expertise and an extremely successful track-record of building great ecosystems by driving innovation and customer success,” said Ofer Elyakim, CEO of DSP Group.
“The opportunity to join DSP Group and leverage the unparalleled benefits of ULE to build the IoT ecosystem for this technology in the US market is exciting,” said Bill Scheffler, VP Business Development at DSP Group. “I believe in the ULE technology and its ability to establish itself as a dominant technology in the burgeoning IoT and VUI markets.”
About DSP Group
DSP Group®, Inc. (NASDAQ:DSPG) is a leading global provider of integrative wireless chipset solutions for converging communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com.
Contact: Tali Chen, Chief Marketing Officer DSP Group, Inc. Tel: +1(408) 240-6826, [email protected]
