inTEST to Participate in December 2018 Investor Conferences

MOUNT LAUREL, N.J., Nov. 27, 2018 (GLOBE NEWSWIRE) — inTEST Corporation (NYSE American: INTT), an independent designer, manufacturer and marketer of thermal management products and semiconductor automatic test equipment (ATE) interface solutions, is pleased to announce that the Company is scheduled to participate in the following investor conferences in December 2018: (i) LD Micro Main Event XI in Los Angeles, CA on Tuesday, December 4, 2018 and (ii) 7th Annual NYC Summit in New York, NY on Tuesday, December 11, 2018.

James Pelrin, President & CEO, and Hugh Regan, Jr., Chief Financial Officer, will be participating on behalf of the Company.  The presentation materials utilized during the conferences will be available on the investor relations section of inTEST’s website at www.intest.com.

LD Micro Main Event XI / December 4, 2018 / Los Angeles, CA
The 11th Annual LD Micro Main Event will take place December 4-6, 2018 at the Luxe Sunset Boulevard Hotel, Los Angeles, CA.  Featuring over 200 companies in the small-cap / micro-cap space, the event will be attended by over 1,000 individuals.  inTEST’s presentation is scheduled for Tuesday December 4^th at 8:30 a.m. Pacific Time.  A live webcast of the presentation will be available on the Company’s website at www.intest.com or via the following URL: http://wsw.com/webcast/ldmicro15/intt.  

For those interested in attending the conference, please contact David Scher at david@ldmicro.com or visit www.ldmicro.com/events for more information.

LD Micro was founded in 2006 with the sole purpose of being an independent resource in the microcap space. What started out as a newsletter highlighting unique companies has transformed into several influential conferences annually (Invitational, Summit, and Main Event). In 2015, LD Micro launched ldmicro.com as a portal to provide exclusive intraday information on the entire sector, including the first pure microcap index (LDMi), which covers stocks in North America with market capitalizations between $50-$300 million. 

INTT’s LD Micro profile: https://www.ldmicro.com/profile/INTT.

7^th Annual NYC Investor Summit / December 11, 2018 / New York, NY
The 7th Annual NYC Summit will take place December 11, 2018 at the Parker New York Hotel, New York City.  The NYC Summit is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration. During the event, investors and analysts will have the opportunity to meet with up to 10 of the 17 management teams during the 30-minute group meeting sessions, as well as opportunities to meet with additional management teams during the breakfast and lunch networking sessions.

The 17 management teams collectively hosting the 2018 NYC Summit include: ACM Research (ACMR), Advanced Energy Industries (AEIS), Aehr Test (AEHR), Alpha & Omega Semiconductor (AOSL), Axcelis (ACLS), BE Semiconductor Industries (BESI.AS), Brooks (BRKS), Cohu (COHU), FormFactor (FORM), Ichor Systems (ICHR), Intermolecular (IMI), inTEST Corporation (INTT), Intevac (IVAC), Kulicke & Soffa (KLIC), Nanometrics (NANO), Rudolph Technologies (RTEC), and Veeco Instruments (VECO).  Cowen is sponsoring the networking luncheon.

The NYC Summit is by invitation only and is open to accredited investors and publishing research analysts.  As space is limited, please RSVP early.  Hosts reserve the right to limit attendance as necessary.  Last day for registration is December 3, 2018.

RSVP Contacts for 7^th Annual NYC Investor Summit
To RSVP for the NYC Summit, please contact either of the Summit’s co-chairs.

About inTEST Corporation
inTEST Corporation designs and manufactures engineered solutions for ATE and other electronic test, as well as industrial process applications.  Our products are used by semiconductor manufacturers to perform development, qualifying and final testing of integrated circuits (ICs) and wafers, and for other electronic test across a range of industries including the automotive, defense/aerospace, energy, industrial and telecommunications markets.  We offer induction heating products for joining and forming metals in a variety of industrial markets, including automotive, aerospace, machinery, wire & fasteners, medical, semiconductor, food & beverage, and packaging.  Specific products include temperature management systems, induction heating products, manipulator and docking hardware products, and customized interface solutions.  We have established strong relationships with our customers globally, which we support through a network of local offices.  For more information visit www.intest.com.