Open-Q™ 670 HDK Enables Rapid Development of Artificial Intelligence (“AI”), Camera, and Multimedia Applications for Feature-Rich Mobile Devices
VANCOUVER, British Columbia, Nov. 08, 2018 (GLOBE NEWSWIRE) — Intrinsyc Technologies Corporation (TSX: ITC and OTCQX: ISYRF) (“Intrinsyc”), a leading developer of intelligent connected devices, today announced the general availability of a new Hardware Development Kit (“HDK”) featuring the Qualcomm® Snapdragon™ 670 Mobile Platform.
To support the ecosystem of technology companies and application providers looking to utilize the advanced features of the Snapdragon 670, Intrinsyc Technologies Corporation is introducing the Open-Q™ 670 HDK. The HDK is an open-frame solution that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, as well as provide original equipment manufacturers (“OEMs”), developers and engineers with next generation software technology and tools to accelerate development and testing of feature-rich mobile devices. It includes the software tools and accessories required to immediately begin development work. The HDK is a full-featured Android development platform that provides an ideal starting point for creating high-performance mobile devices and applications.
The Snapdragon 670 Mobile Platform is the latest addition to the 600-tier family and is designed to support premium technologies found in higher-tier processors. The Snapdragon 670 features highly integrated architectures, including the Qualcomm® AI Engine, which encompasses the Qualcomm® Hexagon™ DSP, Qualcomm® Kryo™ CPU, and Qualcomm Spectra™ ISP, in addition to related software and framework support. Together, these features and improvements can support leading on-device artificial intelligence (AI), camera, and multimedia applications; for high-quality mobile user experiences.
The Snapdragon 670 is the first 600-series processor that will feature the Qualcomm Spectra 250 ISP. It is engineered to improve the quality of the camera, including features like noise reduction, image stabilization, and active depth sensing. The Qualcomm Spectra 250 ISP supports up to 25MP for single cameras and 16MP for dual camera; and also supports the improved ability to record 4K video, which will require 30 percent less power than its predecessor.
The Snapdragon 670 mobile platform also provides a significant leap forward in AI performance. The Qualcomm AI Engine, featured in the Snapdragon 670 Mobile Platform, fuels innovative on-device experiences, for smarter, more intuitive interactions with a 1.8x AI improvement over the Snapdragon 660. It is compatible with machine learning frameworks such as Facebook’s Caffe and Caffe2, Google’s TensorFlow and TensorFlow Lite, the Open Neural Network Exchange (“ONNX”), and Qualcomm Technologies’ own Snapdragon Neural Processing SDK and Qualcomm® Hexagon™ Neural Network (“NN”).
Open-Q™ 670 Hardware Development Kit Specifications:
- Qualcomm® Snapdragon™ 670 Mobile Platform with Qualcomm® Kryo™ 360 CPU with two performance cores (of up to 2.0GHz) and six efficiency cores (of up to 1.7GHz), Qualcomm® Adreno™ 615 GPU, and Qualcomm® Hexagon™ 685 DSP with Hexagon Vector extensions
- Memory
• eMCP: 64GB eMMC 5.1 + LPDDR4x up to 1866MHz 6GB RAM - Connectivity:
• WCN3990 Atheros Wi-Fi + BT +FM 802.11 a/b/g/n/ac 2.4/5.0 GHz
• Bluetooth 5.0
• GNSS (GPS/GLONASS/COMPASS/GALILEO) - I/O Interfaces:
• 1x USB 3.1 Type-C with DisplayPort output
• 1x USB 2.0 micro-B (UART Debug)
• 1x Micro SD Card slot
• 1x MIPI 4-lane DSI + touch panel interface
• 3x MIPI 4-lane CSI with support for 3D camera configuration
• 1X MIPI 2-lane via a 23-pin connector - Audio Connectors:
• 1 x Headset Output
• 2 x Loud-speaker
• 1 x Earpiece output
• 3 x analog MICs
• 3 x digital MICs - Expansion headers for additional features
• 20-pin NFC
• 24-pin Sensor I/O1x Audio Input and 1x Audio Output Expansion Headers
• 1 JTAG - Operating System: Android 8
- Optional Accessories:
• Battery: 4.4V/2850mAh
• Display: TFT LCD (2160×1080) with PCAP Touch Panel, 5.65”
• Cameras: 8M FF, Single 12M 2PD, Dual 12M+13M OZ+OIS
“The Snapdragon 670 Mobile Platform brings significant enhancement in artificial intelligence (“AI”), camera, and multimedia capabilities to the 600-tier processor family; providing at a great value for mobile device makers,” said Cliff Morton, Vice President, Client Solutions, Intrinsyc Technologies Corporation. “The HDK provides device makers and technology companies access to the Snapdragon 670 Mobile Platform and software tools, and Intrinsyc offers the expertise and support they need to accelerate their product development.”
Users of the Open-Q™ 670 Development Kit will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc’s technical support services.
The Open-Q™ 670 Development Kit is available to order at:
https://shop.intrinsyc.com
About Intrinsyc Technologies Corporation
Intrinsyc Technologies is a product development company that provides comprehensive and tailored solutions that enable the development and production of next-generation intelligent connected devices. Solutions span the product development life cycle from concept to production and help makers of intelligent connected devices create compelling differentiated products with faster time-to-market. Intrinsyc is publicly traded (TSX: ITC and OTCQX: ISYRF) and is headquartered in Vancouver, BC, Canada. See https://www.intrinsyc.com for more information.
For more information, please contact:
Cliff Morton
Vice President, Client Solutions
Intrinsyc Technologies Corporation
Email: cmorton@intrinsyc.com
Phone: +1-604-801-6461
Intrinsyc and Open-Q are trademarks of Intrinsyc Technologies Corporation.
Qualcomm, Snapdragon, Kryo, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Spectra is a trademark of Qualcomm Incorporated.
Qualcomm Snapdragon, Qualcomm AI Engine, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. and/or its subsidiaries.